Low Temperature Sn42/Bi58 BGA SMD Solder Paste 10cc

Description

Low Temperature Sn42/Bi58 BGA SMD Solder Paste 10cc

This low melting temperature solder paste is a great low cost, easy to use alternative to removal alloy. A mixture of Sn42 and Bi58, it melts at 138°C and makes it extremely easy to remove large or fragile components like charge ports and FPC connectors without much heat. The solder paste form is very easy to apply and mix with leaded and lead free solder joints already on the board, especially compared to wire removal alloy. Stop pulling pads and melting connectors today!

Refrigerate when not in use.

Curing type Heating to cure
Usage SMD/BGA Circuit
Curing temperature 70°Cx30min,93°Cx15min,121°Cx5min

Volume: 38g